取消
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ATS-NVA-2780-C1-R0 | Advanced Thermal Solutions | - |
550
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散热片 High Performance Active Heat Sink for NVIDA Jetson Nano Module, 60x40x8mm, T766 | 126.4883 | ||
|
ATS-NVP-3275-C3-R0 | Advanced Thermal Solutions | - |
540
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散热片 Heat Sink for NVIDA Jetson AGX Xavier/AGX Orin Modules, 60x40x8mm, T412 | 224.3393 | ||
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ATS-NVP-2781-C2-R0 | Advanced Thermal Solutions | - |
550
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散热片 High Performance Heat Sink for NVIDA Jetson Xavier NX Module, 60x40x8mm, T766 | 97.9592 | ||
|
40519 | Vicor | - |
663
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散热片 4623 HS Dual Long 11 mm | 333.166 | ||
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29063 | Auvidea | - |
3473
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散热片 Heatsink for NVIDIA Jetson Nano | 22.784 | ||
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HSS-B20-NP | CUI Devices | - |
3634
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散热片 38.1 x 12.8 x 12.7mm TO-220 slide in | 4.3311 | ||
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HS13 | Apex Microtechnology | - |
596
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散热片 Heatsink, T03 | 688.7801 | ||
|
HSS-B20-0508H-01R | CUI Devices | - |
4265
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散热片 29.97 x 25.4 x12.7mm TO-220 bolt on/pin | 3.6984 | ||
|
29062 | Auvidea | - |
1202
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散热片 Heatspreader for NVIDIA Jetson Nano | 30.7544 | ||
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34009-0000-99-2 | Kontron | - |
550
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散热片 HSP COMe-mAL10 E2 slim thread | 149.5 | ||
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6022BG | Aavid | - |
4562
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散热片 Space-Saving Heat Sink, TO220, Stagger, Vertical, 16.7 Degree C/W, 2.36mm Hole | 18.4529 | ||
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70752 | Auvidea | - |
514
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散热片 Heatsink for NVIDIA Jetson Nano black aluminum heatsink and fan for the Jetson Nano | 35.0855 | ||
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HSIB919-1 | IBASE | - |
504
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散热片 AC, Heat Spreader for IB919 series, (RoHS) , H051xxxxxxxx | 234.6432 | ||
|
40482 | Vicor | - |
506
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散热片 4623 HS Top Tran 11 mm | 142.2014 | ||
|
LEC-IMX6-HS | ADLINK Technology | - |
510
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散热片 LEC-iMX6-HSHeatspreader for LEC-iMX6 Quad/Dual | 138.6816 | ||
|
HSIB811-I | IBASE | - |
502
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散热片 Heatsink for IB811-I30 and IB811-I50 | 268.8683 | ||
|
|
38030-0000-99-0 | Kontron | - |
585
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散热片 HSP COMe-bSL6 Cu-core threaded | 242.05 | ||
|
114992686 | Seeed Studio | - |
694
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散热片 Jetson Nano Module Heatsink | 60.4798 | ||
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ATS-HK379-R0 | Advanced Thermal Solutions | - |
1212
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散热片 Cooler Backing Plate, 96x96 LxW, 80mm Hole-Hole, 6mm Standoff Height, AI | 18.907 | ||
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HSE05-171933 | CUI Devices | - |
1951
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散热片 heat sink, extrusion, TO-218/TO-220, 17 x 19.4 x 32.5 mm | 8.0295 | ||
|
HSE02-173213 | CUI Devices | - |
2000
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散热片 heat sink, extrusion, 17 x 31.9 x 12.5 mm | 8.0295 | ||
|
81004-0000-99-1 | Kontron | - |
513
|
散热片 HSP-Qseven-Q7AL2 | 92.55 | ||
|
HSS14-B20-NP | CUI Devices | - |
6308
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散热片 heat sink, stamping, TO-220, 19.05 x 24. | 4.5588 | ||
|
HSB05-171711 | CUI Devices | - |
2499
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散热片 heat sink, BGA, 17 x 17 x 11.5 mm | 6.1514 | ||
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1960092232T000 | Advantech | - |
503
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散热片 VEGA 330 Standard heatsink | 53.073 |
